Intel delivered a 17-qubit chip to its research partner in that field, QuTech, the quantum research Institute of Delft University of Technology in the Netherlands. The company has created a new superconducting chip through advanced materials science and manufacturing techniques.
As Quantum computing is the next big technological revolution, the company is moving toward production system to deliver it to spec and to accelerate advancements in quantum computing.
According to Intel, the component or modules of quantum computing qubits are very fragile. They can only run at extremely low temperatures and must be covered carefully to prevent data loss. You can pack a multi-qubit quantum computing system in a cooled millikelvin level, in an area the size of an oil drum.
Intel’s research teams in Oregon and Arizona have identified a way that will make the manufacturing of 17-qubits with and architecture chips more reliable at higher temperatures and also reduce RF interference between each qubit. The chip will have capability of sending and receiving 10 to 100 times more signal than comparable wire-bonded chips.
Intel Lab’s Dr. Michael Mayberry said, “Our quantum research has progressed to the point where our partner QuTech is simulating quantum algorithm workloads, and Intel is fabricating new qubit test chips on a regular basis in our leading-edge manufacturing facilities.”
The company’s next step is to test and characterize all the functions of the qubits in the device including their individual performance and also how they all perform together when they’re entangled.